SPGA, Interstitial in TH with max. pin count of 592

  • Custom specific pin counts with grids to 41x41
  • Pin-Grid-Array precision-IC-Sockets, with displaced contacts, for picking up of ICs with high packing density.
  • Contacts with 6-finger-clip, for low insertion and withdrawal forces 

Insulation Resistance:  1012Ω min.
Withstanding Voltage:1,000 VRMS for 1 minute
Contact Resistance:10mΩ max. at 10mA / 20mV
Current Rating:1A max.
Operating Temperature Range:-55°C ~  +125°C
Acceptable Pin Diameter:0.46 ±0.05
Mating Cycles:100 insertions min.

Housing: PCT, 30% glass filled Polyester, UL94V-0
Contact: Inner clip – Beryllium Copper (BeCu), Au over Ni (2-3µm)
Outer sleeve – Machined Brass, Sn (5µm) over Ni (2-3µm)

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