Dual Inline Memory Modules (144 pins), TH

  • 144 contact pins
  • Card thickness 1.00mm
  • 4 different positioning indicators

Insulation Resistance: 1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:    30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –55°C to +170°C
Mating Cycles: 10,000 insertions min.

Housing: Polyetherimide (PEI), glass-filled
Contacts:  Beryllium Copper (BeCu)
Plating: Gold over Nickel

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