Dual Inline Memory Modules (168 pins), TH

  • 168 contact pins with 1.27mm pitch
  • Card thickness 1.27mm
Insulation Resistance:  1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage:  700V AC for 1 minute
Contact Resistance: 30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –55°C to +170°C
Mating Cycles: 10,000 insertions
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:  Gold over Nickel
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