Dual Inline Memory Modules (184 and 240 pins), TH

  • 184 and 240 contact pins
  • Card thickness 1.27mm with 1.00mm pitch

Insulation Resistance: 1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –55°C to +170°C
Mating Cycles:   10,000 insertions min.

Housing:   Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:  Gold over Nickel

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