Single Inline Memory Module, TH

  • Card thickness 1.27mm
  • Kelvin type contact which utiIizes both sides of the contact system
  • Easy insertion and extraction by latch

Insulation Resistance:  1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:   30mΩ max. at 10mA/20mV max.
Current Rating:   1A max.
Operating Temperature Range: –40°C to +150°C
Mating Cycles:    10,000 insertions min.

Housing: Polyetherimide (PEI), glass-filled
Polyethersulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:  Gold over Nickel
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