Pin Through Hole Devices

Single Inline Package 1.27 to 2.00mm Pitch (7 to 56 pins) TH

Series: IC70
  • 1.27 to 1.778mm pitch
  • Dual wipe contacts ensure high reliability
  • Low costs due to selective gold plating

Zig-Zag Inline Package 1.27 to 1.778mm Pitch (12 to 60 Pins) TH

Series: IC39
  • 1.27 to 1.778mm pitch
  • Applicable for Zig-Zag mounted leads
  • Dual wipe contacts ensure high reliability

Dual Inline Package 14 to 48 Pins 2.54mm Pitch TH

Series: IC37
  • 2.54mm pitch
  • Dual wipe contacts ensure high reliability
  • Low costs due to selective gold plating

Shrink Dual Inline Packge 1.788mm Pitch (20 to 90 pins) TH

Series: IC76
  • Shrink pitch (1.778mm) sockets for high-density mounting
  • Dual wipe contacts ensure high reliability

Shrink Dual Package 1.788mm Pitch (SDIP) TH

Series: IC121
  • Shrink pitch (1.778mm) sockets for high-density mounting
  • Dual wipe contacts ensure high reliability
  • Two terminal lengths (3mm / 5mm) available.

Pin Grid Array 1020 pins (Interstitial) TH

Series: NP236
  • 1.27mm pitch
  • Interstitial
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Deutschland GmbH

Concor Park
Bahnhofstraße 20
85609 Aschheim-Dornach

Phone +49 89 45109-0
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