Dual Inline Package 14 to 48 Pins 2.54mm Pitch TH

  • 2.54mm pitch
  • Dual wipe contacts ensure high reliability
  • Low costs due to selective gold plating
  • Applicable for IC packages and side braze packages
  • Ideal for automated burn-in

Insulation Resistance: 1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 20mΩ max.
at 10mA/20mV max.
Contact Resistance:20mΩ max. at 10mA/20mV max.
Current Rating: 1A max.
Operating Temperature Range: –40°C to +170°C (PPS)
Mating Cycles:25,000 to 50,000 insertions

Housing:Polyphenylenesulfide (PPS), glass filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel

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85609 Aschheim-Dornach

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