Shrink Dual Inline Packge 1.788mm Pitch (20 to 90 pins) TH

  • Shrink pitch (1.778mm) sockets for high-density mounting
  • Dual wipe contacts ensure high reliability

Insulation Resistance:1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage:700V AC for 1 minute
Contact Resistance: 20mΩ max. at 10mA/20mV max.
Current Rating: 1A max.
Operating Temperature Range: –40°C to +170°C (PES)
Mating Cycles:25,000 to 50,000 insertions

Housing:Polysulphone (PSF),
glass-filled Polyethersulphone (PES)
Contacts:Beryllium Copper (BeCu)
Plating: Gold over Nickel

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