Universal Sockets for SON/QFN/BGA/CSP/LGA

Series IC561, IC564, (Clamshell) and NP584 (Open Top):

  • Semi-custom socket suitable for SON, QFN, BGA, CSP, LGA packages
  • Dimensions from 2x2 to 15x15 mm sq. (rectangle to MAX 14.5x16.5)
  • Pitch from 0.30mm standard, staggered or irregular
  • Spring loaded pusher
  • Airflow through top duct channel
  • One outline for all packages
  • Compression mount (CMT) for quick installation and maintenance
  • Full flexibility through drilled insulator and milled pusher
  • Low cost with respect to a full custom solution

Insulation Resistance:1000MΩ min. at 100V DC
Contact Force: See PDF Data Sheet
Operating Temp. Range:–55°C to +150°C
Mating Cycles:10,000 insertions min.
Housing: Polyester (PES), glass-filled
Polyetherimide (PEI), glass-filled
Contacts:      Beryllium Copper (BeCu)
Plating:Gold over Nickel
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For enquiries contact:
Enrico Tarizzo
Product Manager

+49 89 45109-143  enrico.tarizzo@yamaichi.de

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