Features
- Open top THT socket solution suitable for BGA packages with 0.80 mm pitch
- Self-contacting structure without upper pressing force (ZIF)
- Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls
Advantages
- Open Top solution suitable for a huge variety of BGA packages up to 25 x 25 sqmm outline dimensions
- Different socket outline dimensions in order to fit the packages
- Suitable for autoloading testing equipment
Specifications
General Specification
- Mating Cycles
10 - Operating Temperature Range
-55 °C – 150 °C
Electrical Specification
- (Initial) Contact Resistance
100 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
100 V AC - Current Rating
1 A
Interface Specification
- Pitch
0.75 - Pin Count / Numbers of pins
500
