- Open top THT solution for BGA packages with different pitch
- Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
- Double Buckle Beam contact
EN
NP504-Series - Open Top
Features
Advantages
- Open top THT solution suitable for autoloading
- Compact size for high density boards
- Easy handling for manual operation too
- Double Buckle Beam contact type suitable for small and package dimensions and pitch
Specifications
General Specification
- Operating Temperature Range
-55 °C – 150 °C
Electrical Specification
- (Initial) Contact Resistance
100 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
100 V AC - Current Rating
1 A
Interface Specification
- Pin Count / Numbers of pins
850
