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IC564-Series - Universal Socket

Features

  • Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
  • IC package dimensions from 2 x 2 to 10 x 10 sqmm
  • Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular

Advantages

  • Ability to support both burn-in & validation test
  • Compression Mount Technology (CMT) for quick installation and maintenance
  • Full flexibility through drilled insulator and milled pusher

Specifications

General Specification
  • Mating Cycles
    20,000
  • Operating Temperature Range
    -40 °C – 150 °C
Electrical Specification
  • (Initial) Contact Resistance
    500 Milliohm
  • Insulation Resistance
    1 Megaohm
  • Current Rating
    1,15 A
Interface Specification
  • Pitch
    0.3
  • Pin Count / Numbers of pins
    280