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IC51-Series - Clamshell

Features

  • Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
  • Pitch from 0.40 mm up to 1.27 mm standard
  • Cantilever stamped contact type
  • IC orientation, Live bug

Advantages

  • A solid concept able to accommodate different package types, size, pitch and thickness
  • Socket outline according to package size
  • Solution suitable for manual handling
  • Cantilever stamped single tip contact
  • Exposed pad connection optional

Specifications

General Specification
  • Mating Cycles
    10,000
  • Operating Temperature Range
    -55 °C – 170 °C
Electrical Specification
  • (Initial) Contact Resistance
    30 Milliohm
  • Insulation Resistance
    1000 Megaohm
  • (Dieletric) Withstanding Voltage
    100 V AC
  • Current Rating
    1 A
Interface Specification
  • Pin Count / Numbers of pins
    208