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- Interface Solutions
- Kontaktierung von Halbleitern
- Universalsockel IC561, IC564 & NP584
- Ball and Pad Devices (BGA CSP LGA)
- Quad Flat Non-Leaded (QFN)
- Quad Flat Packages Gullwing Leads (QFP)
- Small Outline Packages Gullwing Leads (SOP)
- J-Leads (SOJ PLCC)
- Non-Leaded Devices (LCC)
- Single Inline Package (SIP)
- Dual Inline Package (DIP)
- Burn-In Lead Frame Sockets
- PCB Full Custom Solutions
- Specialities – Customized Designs
