- Y-SPE2-J9STTMP-11-NOALR1T
- Mating face according to IEC 63171-2
- 90° version for THR soldering
- Small in size and weight
- Future oriented technology towards industry 4.0
Features
Advantages
- Transmission lengths of up to 1,000 m and transmission rates up to 10 GB/s
- Additional power transmission up to 50 W via Power over Data Line (PoDL) possible
- Mating faces of sub-standards IEC 63171-2 /-5 /-6 /-7 with IP20 or IP6X solutions available
- M12 based connectors with screw or Push-Pull locking mechanism (acc. IEC 61076-2-012)
Specifications
General Specification
- Mating Cycles
1,000 - Operating Temperature Range
-40 °C – 85 °C - Plating type, technology and coating thickness
In contact area:Min 30μ’’ Au over min 60μ’’ Ni
In soldering area:Min.80μ’’ Sn over min.60μ’’Ni - Packaging
Tray - Contact Type
Solder - IP Class
IP20
Electrical Specification
- (Initial) Contact Resistance
10 Milliohm at 3 A - Insulation Resistance
500 Milliohm at 500 - (Dieletric) Withstanding Voltage
1000 V DC for 1 minute pin to pin - Current Rating
3 A 1 minute pin to shield/ground - Voltage Rating
60 V DC
Interface Specification
- Soldering Technology
THR & SMD - In case of THR or SMD: according to
J-STD-020D or newer - Pitch
2 - Pin Count / Numbers of pins
2 - Contact Type
Solder