- Open top THT sockets for BGA packages with 1.00 mm pitch
- Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
- Tweezer contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls
Features
Advantages
- Open Top solution for very large BGA packages
- Suitable for autoloading testing equipment
Specifications
General Specification
- Mating Cycles
10,000 - Operating Temperature Range
-40 °C – 150 °C
Electrical Specification
- (Initial) Contact Resistance
100 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
100 V AC - Current Rating
1 A
Interface Specification
- Pitch
1 - Pin Count / Numbers of pins
1,800