- Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
- Pitch from 0.40 mm up to 1.27 mm standard
- Cantilever stamped contact type
- IC orientation, Live bug
Features
Advantages
- A solid concept able to accommodate different package types, size, pitch and thickness
- Socket outline according to package size
- A solid concept able to accommodate different package types, size, pitch and thickness
- Socket outline according to package size
- Solution suitable for manual handling
- Cantilever stamped single tip contact
- Exposed pad connection optional
Specifications
General Specification
- Mating Cycles
10,000 - Operating Temperature Range
-55 °C – 170 °C
Electrical Specification
- (Initial) Contact Resistance
30 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
700 V AC - Current Rating
1 A
Interface Specification
- Pitch
1.27 - Pin Count / Numbers of pins
124