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IC609-Series - Clamshell

Features

  • Clamshell THT socket solution for QFN packages with 0.40 mm pitch
  • Centre contact available for exposed pads
  • Suitable for 0.5 - 1.2 mm thick packages

Advantages

  • Very compact dimensions and easy handling structure suitable for manual loading operation
  • Stamped cantilever contact
  • Optimized package pushing plate size to push it evenly and minimize the load on its surface

Specifications

General Specification
  • Mating Cycles
    10,000
  • Operating Temperature Range
    -40 °C – 150 °C
Electrical Specification
  • (Initial) Contact Resistance
    100 Milliohm
  • Insulation Resistance
    1000 Megaohm
  • (Dieletric) Withstanding Voltage
    100 V AC
  • Current Rating
    1 A
Interface Specification
  • Pitch
    0.4
  • Pin Count / Numbers of pins
    108