- Clamshell THT socket solution for QFN packages with 0.40 mm pitch
- Centre contact available for exposed pads
- Suitable for 0.5 - 1.2 mm thick packages
Features
Advantages
- Very compact dimensions and easy handling structure suitable for manual loading operation
- Stamped cantilever contact
- Optimized package pushing plate size to push it evenly and minimize the load on its surface
Specifications
General Specification
- Mating Cycles
10,000 - Operating Temperature Range
-40 °C – 150 °C
Electrical Specification
- (Initial) Contact Resistance
100 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
100 V AC - Current Rating
1 A
Interface Specification
- Pitch
0.4 - Pin Count / Numbers of pins
108