QFN11T-Series - Clamshell

Features

Clamshell THT socket solution for QFN packages with 0.40 mm to 0.80 mm pitch
Suitable for package outline size in the range up to 10 x 10 sqmm and 0.50 - 1.30 mm thickness
Cantilever stamped contact type structure
Centre signal contacts (thermal / electrical) available for exposed pads

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Advantages

Suitable solution for manual testing
Twin beam contacts stamped type contact to guarantee electrical signal stability
Ground Pin option available for exposed pads, heat sink
Floating base non sticking option

Specifications

General Specification

Mating Cycles
10,000
Operating Temperature Range
-40 °C – 150 °C

Electrical Specification

(Initial) Contact Resistance
100 Milliohm
Insulation Resistance
1000 Megaohm
(Dieletric) Withstanding Voltage
100 V AC

Interface Specification

Pitch
0.4
Pin Count / Numbers of pins
88

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