open menu

Y-RED Failure Analysis Socket

Features

  • For pitches starting at 0.30 mm
  • Suitable for packages CSP/BGA, LGA and QFN
  • Usage for semiconductor chip failure analysis
  • Glass Plate to push device with a large transmission bandwidth
Request Product

Advantages

  • Fitting footprint to Y-RED evaluation socket
  • Low inductance Y-RED with very low self-inductance
  • Easy socket to PCB assembly with pre-assembled mounting plate
  • Optional stiffener

Specifications

General Specification
  • Mating Cycles
    50,000
  • Socket Type
    Open Top
Interface Specification
  • Pitch
    0.3
  • Pin Count / Numbers of pins
    1,200

Video