- Suitable for packages CSP/BGA, LGA and QFN
- Usage for semiconductor chip failure analysis
- Glass Plate to push device with a large transmission bandwidth
Features
Advantages
- Fitting footprint to Y-RED evaluation socket
- Low inductance Y-RED with very low self-inductance
- Easy socket to PCB assembly with pre-assembled mounting plate
- Optional stiffener
Specifications
General Specification
- Mating Cycles
50,000 - Operating Temperature Range
-55 °C – 150 °C - Socket Type
Open Top
Interface Specification
- Pitch
0.3 - Pin Count / Numbers of pins
1,200