- Open top THT sockets for BGA packages with 1.27 mm pitch
- Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
- Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity
Features
Advantages
- Open Top solution suitable mainly for large BGA packages
- Different socket outline dimensions in order to fit the packages
- Suitable for autoloading testing equipment
Specifications
General Specification
- Mating Cycles
10,000 - Operating Temperature Range
-55 °C – 150 °C
Electrical Specification
- (Initial) Contact Resistance
30 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
100 V AC - Current Rating
1,5 A
Interface Specification
- Pitch
1.27 - Pin Count / Numbers of pins
1,105