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NP276-Series - Open Top

Features

  • Open top THT sockets for BGA packages with 1.27 mm pitch
  • Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
  • Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity

Advantages

  • Open Top solution suitable mainly for large BGA packages
  • Different socket outline dimensions in order to fit the packages
  • Suitable for autoloading testing equipment

Specifications

General Specification
  • Mating Cycles
    10,000
  • Operating Temperature Range
    -55 °C – 150 °C
Electrical Specification
  • (Initial) Contact Resistance
    30 Milliohm
  • Insulation Resistance
    1000 Megaohm
  • (Dieletric) Withstanding Voltage
    100 V AC
  • Current Rating
    1,5 A
Interface Specification
  • Pitch
    1.27
  • Pin Count / Numbers of pins
    1,105

Video