Features
- Open top type THT sockets for a huge variety of BGA packages 1.00 mm pitch
- Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
- Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls
Advantages
- Open Top solution suitable for a huge variety of BGA packages
- Different socket outline dimensions in order to fit the packages
- Suitable for autoloading testing equipment
Specifications
General Specification
- Mating Cycles
10,000 - Operating Temperature Range
-55 °C – 150 °C - Socket Type
Open Top
Electrical Specification
- (Initial) Contact Resistance
100 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
100 V AC - Current Rating
1 A
Interface Specification
- Pitch
1 - Pin Count / Numbers of pins
1,850
