- Open top THT socket solution suitable for BGA packages with 0.50 mm pitch
- 2-point Tweezer Style contact system to nip the sides of solder balls to prevent damages of co-planarity of solder balls
EN
NP383-Series - Open Top
Features
Advantages
- Open Top solution suitable for autoloading
- Compact dimensions to maximize BIB density
- Easy handling for manual operation too
Specifications
General Specification
- Mating Cycles
10,000 - Operating Temperature Range
-40 °C – 150 °C
Electrical Specification
- (Initial) Contact Resistance
100 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
100 V AC - Current Rating
1 A
Interface Specification
- Pitch
0.5 - Pin Count / Numbers of pins
300
