Features
- Open top THT socket solution for QFN packages with 0.40 mm and 0.50 mm pitch
- Suitable for package outline size in the range 4 - 8 sqmm and 0.70 - 1.30mm thickness
- Active alignment for IC package positioning
- Cantilever stamped contact type structure
- Centre signal contacts (thermal / electrical) available for exposed pads
Advantages
- Squared compact dimensions suitable for automatic loading operation
- Selectable cover outline size (25 x 25 sqmm and 27 x 27 sqmm)
- Twin beam stamped contact to guarantee electrical signal stability
- 4 latches package warping manage
- Package Centering Mechanism option
- Ground Pin optional
Specifications
General Specification
- Mating Cycles
10,000 - Operating Temperature Range
-40 °C – 150 °C
Electrical Specification
- (Initial) Contact Resistance
100 Milliohm - Insulation Resistance
1000 Megaohm - (Dieletric) Withstanding Voltage
100 V AC
Interface Specification
- Pitch
0.4 - Pin Count / Numbers of pins
88
