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Y-RED Standard & Low Inductance Socket
  • For pitches starting at 0.30 mm
  • Suitable for packages CSP/BGA, LGA and QFN
  • Usage for standard lab & reliablity applications
YED254 Test Contactor
  • Customised Test Contactor for pitch sizes ≥ 0.30 mm
  • Easy to close cover
  • Higher temperature range available
YED274 Test Contactor
  • Customised Test Contactor with Pitch sizes ≥ 0.25 mm
  • Manual or automated applications
  • Contact force (typical) between 15 g to 35 g
IC561-Series - Universal Socket
  • Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
  • Pitch from 0.30mm standard, staggered or irregular
  • Full flexibility through drilled insulator and milled pusher
IC564-Series - Universal Socket
  • Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
  • IC package dimensions from 2 x 2 to 10 x 10 sqmm
  • Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular
IC609-Series - Clamshell
  • Clamshell THT socket solution for QFN packages with 0.40 mm pitch
  • Centre contact available for exposed pads
  • Suitable for 0.5 - 1.2 mm thick packages
IC610-Series - Clamshell
  • Clamshell THT socket solution for QFN packages with 0.50 mm pitch
  • Centre contact available for exposed pads
  • Suitable for 0.5 - 1.2 mm thick packages
NP404-Series - Open Top
  • Open top THT socket solution for QFN packages with 0.50 mm pitch
  • Centre signal contacts (electrical) available for exposed pads
  • Suitable for 0.5 - 1.2mm thick packages
NP445-Series - Open Top
  • Open top THT socket solution for QFN packages with 0.50 mm pitch
  • Centre signal contacts (electrical) available for exposed pads
  • Suitable for packages up to 1.00 mm thick
NP506-Series - Open Top
  • Open top THT socket solution for QFN packages with 0.40 mm and 0.50 mm pitch
  • Suitable for package outline size in the range 4 - 8 sqmm and 0.70 - 1.30mm thickness
  • Active alignment for IC package positioning
NP584-Series - Universal Socket
  • Semi-custom open top CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
  • Pitch from 0.30mm standard, staggered or irregular
  • Full flexibility through drilled insulator and milled pusher
QFN11T-Series - Clamshell
  • Clamshell THT socket solution for QFN packages with 0.40 mm to 0.80 mm pitch
  • Suitable for package outline size in the range up to 10 x 10 sqmm and 0.50 - 1.30 mm thickness
  • Cantilever stamped contact type structure