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Connector Solutions
Push-Pull Circular Connector Y-Circ P
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Push-Pull Circular Connector Y-Circ P
Y-Circ P - B-Series (IP50)
Y-Circ P - T-Series (IP68)
Y-Circ P - S-Series (IP50)
Y-Circ P - Configurator
M12 Circular Connector Y-Circ M
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M12 Circular Connector Y-Circ M
M12 Push-Pull Connectors
Assembled Cables
M12 Connector for Field Assembly
RJ45 Industrial Connectors Y-Con
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RJ45 Industrial Connectors Y-Con
Y-Con IP20
Y-Con IP67 / 68 / 69K
Y-Con Jacks
Y-Con Plugs
Y-Con Tools
Input/Output Connectors
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Input/Output Connectors
Y-Quad Connection Boxes
Y-CCC Car-Computing-Connector
Fakra Connectors
HSD Connectors
USB
HDMI
Display Port
Cable Assemblies
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Cable Assemblies
Standard Cable Assemblies
Customised Cable Assemblies
High-Speed Data Networking
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High-Speed Data Networking
CFP2 Connectors
CFP4 Connectors
CFP8 Connectors
OSFP Connectors
QSFP Connectors
QSFP-DD Connectors
SFP Connectors
DSFP / NGSFP Connectors
Internal Connectors
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Internal Connectors
Special Board-To-Board Connectors
Y-Lock Connector Series
ZIF Connector Series
High Speed Board-to-Cable Series
Card Connectors
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Card Connectors
SIM Card Connectors
MICRO-SIM Card Connectors
SD Card Connectors
MICRO-SD Card Connectors
Cables
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Cables
FFC – Flexible Flat Cables
High-Speed FPC Y-Flex
Customised Solutions
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Customised Solutions
Hot-Melt Technology Y-HMT
Flexible Board-to-Board Jumper
Test Solutions
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Test Solutions
Interface Solutions
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Interface Solutions
Y-ETI Series
Automotive Test Adapter
CoM Testadapter
FPC/FFC Testsockel
Contacting Semiconductors
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Contacting Semiconductors
Ball and Pad Devices (BGA CSP LGA)
Quad Flat Non-Leaded (QFN)
Quad Flat Packages Gullwing Leads (QFP)
Small Outline Packages Gullwing Leads (SOP)
J-Leads (SOJ PLCC)
Non-Leaded Devices (LCC)
Single Inline Package (SIP)
Dual Inline Package (DIP)
Burn-In Lead Frame Sockets
PCB Full Custom Solutions
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PCB Full Custom Solutions
PCB Full Custom Service
Specialities – Customized Designs
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Specialities – Customized Designs
Dockings & Accessory
High Rel
Imaging Sensor Sockets
Receptacles
Markets
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Test Solutions
Contacting Semiconductors
Quad Flat Non-Leaded (QFN)
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Interface Solutions
Contacting Semiconductors
Ball and Pad Devices (BGA CSP LGA)
Quad Flat Non-Leaded (QFN)
Quad Flat Packages Gullwing Leads (QFP)
Small Outline Packages Gullwing Leads (SOP)
J-Leads (SOJ PLCC)
Non-Leaded Devices (LCC)
Single Inline Package (SIP)
Dual Inline Package (DIP)
Burn-In Lead Frame Sockets
PCB Full Custom Solutions
Specialities – Customized Designs
Y-RED Standard & Low Inductance Socket
For pitches starting at 0.30 mm
Suitable for packages CSP/BGA, LGA and QFN
Usage for standard lab & reliablity applications
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YED254 Test Contactor
Customised Test Contactor for pitch sizes ≥ 0.30 mm
Easy to close cover
Higher temperature range available
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YED274 Test Contactor
Customised Test Contactor with Pitch sizes ≥ 0.25 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g
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IC561-Series - Universal Socket
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher
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IC564-Series - Universal Socket
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
IC package dimensions from 2 x 2 to 10 x 10 sqmm
Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular
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IC609-Series - Clamshell
Clamshell THT socket solution for QFN packages with 0.40 mm pitch
Centre contact available for exposed pads
Suitable for 0.5 - 1.2 mm thick packages
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IC610-Series - Clamshell
Clamshell THT socket solution for QFN packages with 0.50 mm pitch
Centre contact available for exposed pads
Suitable for 0.5 - 1.2 mm thick packages
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NP404-Series - Open Top
Open top THT socket solution for QFN packages with 0.50 mm pitch
Centre signal contacts (electrical) available for exposed pads
Suitable for 0.5 - 1.2mm thick packages
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NP445-Series - Open Top
Open top THT socket solution for QFN packages with 0.50 mm pitch
Centre signal contacts (electrical) available for exposed pads
Suitable for packages up to 1.00 mm thick
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NP506-Series - Open Top
Open top THT socket solution for QFN packages with 0.40 mm and 0.50 mm pitch
Suitable for package outline size in the range 4 - 8 sqmm and 0.70 - 1.30mm thickness
Active alignment for IC package positioning
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NP584-Series - Universal Socket
Semi-custom open top CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher
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QFN11T-Series - Clamshell
Clamshell THT socket solution for QFN packages with 0.40 mm to 0.80 mm pitch
Suitable for package outline size in the range up to 10 x 10 sqmm and 0.50 - 1.30 mm thickness
Cantilever stamped contact type structure
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