EN
DE
Connector Solutions
Back to list
Connector Solutions
Push-Pull Circular Connector Y-Circ P
Back to Connector Solutions
Push-Pull Circular Connector Y-Circ P
Y-Circ P - B-Series (IP50)
Y-Circ P - T-Series (IP68)
Y-Circ P - S-Series (IP50)
Y-Circ P - Configurator
M12 Circular Connector Y-Circ M
Back to Connector Solutions
M12 Circular Connector Y-Circ M
M12 Push-Pull Connectors
Assembled Cables
M12 Connector for Field Assembly
RJ45 Industrial Connectors Y-Con
Back to Connector Solutions
RJ45 Industrial Connectors Y-Con
Y-Con IP20
Y-Con IP67 / 68 / 69K
Y-Con Jacks
Y-Con Plugs
Y-Con Tools
Input/Output Connectors
Back to Connector Solutions
Input/Output Connectors
Y-Quad Connection Boxes
Y-CCC Car-Computing-Connector
Fakra Connectors
HSD Connectors
USB
HDMI
Display Port
Cable Assemblies
Back to Connector Solutions
Cable Assemblies
Standard Cable Assemblies
Customised Cable Assemblies
High-Speed Data Networking
Back to Connector Solutions
High-Speed Data Networking
CFP2 Connectors
CFP4 Connectors
CFP8 Connectors
OSFP Connectors
QSFP Connectors
QSFP-DD Connectors
SFP Connectors
DSFP Connectors
Internal Connectors
Back to Connector Solutions
Internal Connectors
Special Board-To-Board Connectors
Y-Lock Connector Series
ZIF Connector Series
High Speed Board-to-Cable Series
Card Connectors
Back to Connector Solutions
Card Connectors
SIM Card Connectors
MICRO-SIM Card Connectors
SD Card Connectors
MICRO-SD Card Connectors
Cables
Back to Connector Solutions
Cables
FFC – Flexible Flat Cables
High-Speed FPC Y-Flex
Test Solutions
Back to list
Test Solutions
Interface Solutions
Back to Test Solutions
Interface Solutions
Y-ETI Series
Automotive Test Adapter
Computer on Module Test Adapter
Contacting Semiconductors
Back to Test Solutions
Contacting Semiconductors
Ball and Pad Devices (BGA CSP LGA)
Quad Flat Non-Leaded (QFN)
Quad Flat Packages Gullwing Leads (QFP)
Small Outline Packages Gullwing Leads (SOP)
J-Leads (SOJ PLCC)
Non-Leaded Devices (LCC)
Single Inline Package (SIP)
Dual Inline Package (DIP)
Burn-In Lead Frame Sockets
PCB Full Custom Solutions
Back to Test Solutions
PCB Full Custom Solutions
PCB Full Custom Service
Specialities – Customized Designs
Back to Test Solutions
Specialities – Customized Designs
Dockings & Accessory
High Rel
Imaging Sensor Sockets
Receptacles
Markets
Back to list
Markets
Semiconductor
Automotive
Data Networking
Automation
Medical
Industry
Measurement & Testing
Automotive Testing
About
Back to list
About
Management Team
History
Production
News
Fairs
Career
Back to list
Career
School Graduates
Students
Professionals
Why Yamaichi
Apply to Yamaichi
Job offers
About
Products
Home
Test Solutions
Contacting Semiconductors
Quad Flat Non-Leaded (QFN)
Show all products
Interface Solutions
Contacting Semiconductors
Ball and Pad Devices (BGA CSP LGA)
Quad Flat Non-Leaded (QFN)
Quad Flat Packages Gullwing Leads (QFP)
Small Outline Packages Gullwing Leads (SOP)
J-Leads (SOJ PLCC)
Non-Leaded Devices (LCC)
Single Inline Package (SIP)
Dual Inline Package (DIP)
Burn-In Lead Frame Sockets
PCB Full Custom Solutions
Specialities – Customized Designs
Y-RED Standard & Low Inductance Socket
For pitches starting at 0.3mm
Suitable for packages CSP/BGA, LGA and QFN
Usage for standard lab & reliablity applications
View product
YED254 Test Contactor
Customised Test Contactor fo pitch sizes ≥ 0.30mm
Easy to close cover
Higher temperature range available
View product
YED274 Test Contactor
Customised Test Contactor with Pitch sizes ≥ 0.25mm
Manual or automated applications
Contact force (typical) between 15 to 35g
View product
IC561-Series - Universal Socket
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher
View product
IC564-Series - Universal Socket
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
IC package dimensions from 2x2 to 10x10 sqmm
Pitch from 0.30mm to 1.30mm standard, staggered or irregular
View product
IC609-Series - Clamshell
Clam shell THT socket solution for QFN pakcages 0.40mm pitch
Centre contact available for exposed pads
Suitable for 0.5÷1.2mm thick packages
View product
IC610-Series - Clamshell
Clam shell THT socket solution for QFN pakcages 0.50mm pitch
Centre contact available for exposed pads
Suitable for 0.5÷1.2mm thick packages
View product
NP404-Series - Open Top
Open top THT socket solution for QFN pakcages 0.50mm pitch
Centre signal contacts (electrical) available for exposed pads
Suitable for 0.5÷1.2mm thick packages
View product
NP445-Series - Open Top
Open top THT socket solution for QFN pakcages 0.50mm pitch
Centre signal contacts (electrical) available for exposed pads
Suitable for packages up to 1.00mm thick
View product
NP506-Series - Open Top
Open top THT socket solution for QFN pakcages 0.40mm and 0.50mm pitch
Suitable for package outline size in the range 4÷8 sqmm 0.70÷1.30mm thick
Active alignment for IC package positioning
View product
NP584-Series - Universal Socket
Semi custom open top CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher
View product
QFN11T-Series - Clamshell
Clam shell THT socket solution for QFN pakcages 0.40mm ÷ 0.80mm pitch
Suitable for package outline size in the range up to 10x10sqmm 0.50÷1.30mm thick
Cantilever stamped contact type structure
View product
