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Connector Solutions
Push-Pull Circular Connector Y-Circ P
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Push-Pull Circular Connector Y-Circ P
Y-Circ P - B-Series (IP50)
Y-Circ P - T-Series (IP68)
Y-Circ P - S-Series (IP50)
Y-Circ P - Configurator
M12 Circular Connector Y-Circ M
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M12 Circular Connector Y-Circ M
M12 Push-Pull Connectors
Assembled Cables
M12 Connector for Field Assembly
RJ45 Industrial Connectors Y-Con
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RJ45 Industrial Connectors Y-Con
Y-Con IP20
Y-Con IP67 / 68 / 69K
Y-Con Jacks
Y-Con Plugs
Y-Con Tools
Input/Output Connectors
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Input/Output Connectors
Y-Quad Connection Boxes
Y-CCC Car-Computing-Connector
Fakra Connectors
HSD Connectors
USB
HDMI
Display Port
Cable Assemblies
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Cable Assemblies
Standard Cable Assemblies
Customised Cable Assemblies
High-Speed Data Networking
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High-Speed Data Networking
CFP2 Connectors
CFP4 Connectors
CFP8 Connectors
OSFP Connectors
QSFP Connectors
QSFP-DD Connectors
SFP Connectors
DSFP Connectors
Internal Connectors
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Internal Connectors
Special Board-To-Board Connectors
Y-Lock Connector Series
ZIF Connector Series
High Speed Board-to-Cable Series
Card Connectors
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Card Connectors
SIM Card Connectors
MICRO-SIM Card Connectors
SD Card Connectors
MICRO-SD Card Connectors
Cables
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Cables
FFC – Flexible Flat Cables
High-Speed FPC Y-Flex
Test Solutions
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Test Solutions
Interface Solutions
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Interface Solutions
Y-ETI Series
Automotive Test Adapter
Computer on Module Test Adapter
Contacting Semiconductors
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Contacting Semiconductors
Ball and Pad Devices (BGA CSP LGA)
Quad Flat Non-Leaded (QFN)
Quad Flat Packages Gullwing Leads (QFP)
Small Outline Packages Gullwing Leads (SOP)
J-Leads (SOJ PLCC)
Non-Leaded Devices (LCC)
Single Inline Package (SIP)
Dual Inline Package (DIP)
Burn-In Lead Frame Sockets
PCB Full Custom Solutions
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PCB Full Custom Solutions
PCB Full Custom Service
Specialities – Customized Designs
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Specialities – Customized Designs
Dockings & Accessory
High Rel
Imaging Sensor Sockets
Receptacles
Markets
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Semiconductor
Automotive
Data Networking
Automation
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Measurement & Testing
Automotive Testing
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Test Solutions
Contacting Semiconductors
Single Inline Package (SIP)
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Interface Solutions
Contacting Semiconductors
Ball and Pad Devices (BGA CSP LGA)
Quad Flat Non-Leaded (QFN)
Quad Flat Packages Gullwing Leads (QFP)
Small Outline Packages Gullwing Leads (SOP)
J-Leads (SOJ PLCC)
Non-Leaded Devices (LCC)
Single Inline Package (SIP)
Dual Inline Package (DIP)
Burn-In Lead Frame Sockets
PCB Full Custom Solutions
Specialities – Customized Designs
IC70-Series - Open Top
Open top THT socket solution suitable for Single Inline packages (SIP)
Pitch from 1.00mm up to 2.00mm standard
Variable socket outline according to package dimensions
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