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Y-RED Standard & Low Inductance Socket
  • For pitches starting at 0.30 mm
  • Suitable for packages CSP/BGA, LGA and QFN
  • Usage for standard lab & reliability applications
YED254 Test Contactor
  • Customised Test Contactor for pitch sizes ≥ 0.30 mm
  • Easy to close cover
  • Higher temperature range available
YED274 Test Contactor
  • Customised Test Contactor with pitch sizes ≥ 0.25 mm
  • Manual or automated applications
  • Contact force (typical) between 15 g to 35 g
IC280-Series - Clamshell
  • Clamshell THT socket solution for different BGA and LGA packages from 0.65mm up to 1.00mm pitch
  • Available in 3 pitch sizes and various depopulation versions
  • V-shape contact structure prevents any damage of coplanarity of the ball contacts
IC398-Series - Open Top
  • Open top CMT solution
  • Suitable for BGA and LGA packages with 0.50 mm pitch
  • U-shape or double bow contact structure
IC409-Series - Clamshell
  • Clamshell CMT solution
  • Suitable for BGA and LGA packages with 0.50 mm pitch
  • U-shape or double bow contact structure
IC511-Series - Clamshell
  • Clamshell CMT solution
  • Suitable for BGA and LGA packages with 0.40 mm pitch
  • U-shape or double bow contact structure
IC561-Series - Universal Socket
  • Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
  • Pitch from 0.30mm standard, staggered or irregular
  • Full flexibility through drilled insulator and milled pusher
IC564-Series - Universal Socket
  • Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
  • IC package dimensions from 2 x 2 to 10 x 10 sqmm
  • Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular
NP276-Series - Open Top
  • Open top THT sockets for BGA packages with 1.27 mm pitch
  • Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
  • Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity
NP291-Series - Open Top
  • Open top THT socket solution suitable for BGA packages with 0.80 mm pitch
  • Self-contacting structure without upper pressing force (ZIF)
  • Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls
NP351-Series - Open Top
  • Open top THT socket solution suitable for BGA packages 0.80 mm pitch
  • Self-contacting structure without upper pressing force (ZIF)
  • Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls