Ball and Pad Arrays (BGA/ CSP/ LGA)

0.40mm Pitch Ball and Pad Array (BGA/ CSP/ LGA)

Series: IC511 IC539 NP437 NP481
  • Compression mount 0.4 to 0.6 mm fan-out type
  • Depopulation versions available

0.50mm Pitch Ball and Pad Array (BGA/ CSP/ LGA)

Series: IC398 IC409 NP504

Series IC398 / IC409 / NP504 / (Open Top and Clamshell - CMT):

  • Compressed Mount Technology (CMT)
  • Depopulation versions available

Series NP383 (Open Top - TH):

  • 2-point Tweezer Style contact system

0.50mm Pitch Ball and Pad Array (BGA/ CSP)

Series: NP383

Series IC398 / IC409 / NP504 / (Open Top and Clamshell - CMT):

  • Compressed Mount Technology (CMT)
  • Depopulation versions available

Series NP383 (Open Top - TH):

  • 2-point Tweezer Style contact system

0.65mm Pitch Ball and Pad Array (BGA/ CSP/ LGA)

Series: NP291
  • V-Shape contact structure to lower the damage of coplanarity of solder balls
  • Available in 3 pitch sizes and various depopulation versions

0.75mm Pitch Ball and Pad Array (BGA/ CSP/ LGA)

Series: NP291 IC280

Series IC280 (Clamshell -TH):

  • V-Shape contact structure to lower the damage of coplanarity of solder balls
  • Available in 3 pitch sizes and various depopulation versions

Series NP291 (Open Top-TH):

  • Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls

1.00mm Pitch Ball and Pad Array (BGA/ CSP/ LGA)

Series: NP481 NP352 NP486 NP483 IC280

Series IC280 (Clamshell -TH):

  • V-Shape contact structure to lower the damage of coplanarity of solder balls
  • Available in 3 pitch sizes and various depopulation versions

Series NP352 / NP483 / NP486 (Open Top-TH):

  • Secure package alignment due to self contacting structure without upper pressing force (ZIF)
  • Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls

1.27mm Pitch Ball and Pad Array (BGA/ CSP/ LGA)

Series: NP276 NP483
  • Open top type sockets for BGA packages
  • Secure packages alignment due to self contacting structure without upper pressing force (ZIF)
  • Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls
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Contact

 


For enquiries contact:
Enrico Tarizzo
Product Manager


Phone
+49 89 45109-143  enrico.tarizzo@yamaichi.de


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