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Y-RED Standard & Low Inductance Socket
Y-RED Standard & Low Inductance Socket
  • For pitches starting at 0.3mm
  • Suitable for packages CSP/BGA, LGA and QFN
  • Usage for standard lab & reliablity applications
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YED254 Test Contactor
YED254 Test Contactor
  • Customised Test Contactor for pitch sizes ≥ 0.30mm
  • Easy to close cover
  • Higher temperature range available
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YED274 Test Contactor
YED274 Test Contactor
  • Customised Test Contactor with pitch sizes ≥ 0.25mm
  • Manual or automated applications
  • Contact force (typical) between 15 to 35g
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IC280-Series - Clamshell
IC280-Series - Clamshell
  • Clam shell THT socket solution for different BGA and LGA pakcages from 0.65mm up to 1.00mm pitch
  • Available in 3 pitch sizes and various depopulation versions
  • V-shape contact structure to lower the damage of coplanarity of solder balls
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IC398-Series - Open Top
IC398-Series - Open Top
  • Open top CMT solution suitable for BGA and LGA packages 0.50 mm pitch
  • U-shape or double bow contact structure
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IC409-Series - Clamshell
IC409-Series - Clamshell
  • Clamshell CMT solution suitable for BGA and LGA packages 0.50 mm pitch
  • U-shape or double bow contact structure
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IC511-Series - Clamshell
IC511-Series - Clamshell
  • Clamshell CMT solution suitable for BGA and LGA packages 0.40 mm pitch
  • U-shape or double bow contact structure
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IC561-Series - Universal Socket
IC561-Series - Universal Socket
  • Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
  • Pitch from 0.30mm standard, staggered or irregular
  • Full flexibility through drilled insulator and milled pusher
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IC564-Series - Universal Socket
IC564-Series - Universal Socket
  • Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
  • IC package dimensions from 2x2 to 10x10 sqmm
  • Pitch from 0.30mm to 1.30mm standard, staggered or irregular
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NP276-Series - Open Top
NP276-Series - Open Top
  • Open top type sockets THT for BGA packages 1.27 mm pitch
  • Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
  • Tweezer contacting structure to nip the sides of solder balls to lower damages of co-planarity of solder balls
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NP291-Series - Open Top
NP291-Series - Open Top
  • Open top THT socket solution suitable for BGA packages 0.80mm pitch
  • Self contacting structure without upper pressing force (ZIF)
  • 2-point Tweezer Style contact system
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NP351-Series - Open Top
NP351-Series - Open Top
  • Open top THT socket solution suitable for BGA packages 0.80mm pitch
  • Self contacting structure without upper pressing force (ZIF)
  • 2-point Tweezer Style contact system
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