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Connector Solutions
Push-Pull Circular Connector Y-Circ P
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Push-Pull Circular Connector Y-Circ P
Y-Circ P - B-Series (IP50)
Y-Circ P - T-Series (IP68)
Y-Circ P - S-Series (IP50)
Y-Circ P - Configurator
M12 Circular Connector Y-Circ M
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M12 Circular Connector Y-Circ M
M12 Push-Pull Connectors
Assembled Cables
M12 Connector for Field Assembly
RJ45 Industrial Connectors Y-Con
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RJ45 Industrial Connectors Y-Con
Y-Con IP20
Y-Con IP67 / 68 / 69K
Y-Con Jacks
Y-Con Plugs
Y-Con Tools
Input/Output Connectors
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Input/Output Connectors
Y-Quad Connection Boxes
Y-CCC Car-Computing-Connector
Fakra Connectors
HSD Connectors
USB
HDMI
Display Port
Cable Assemblies
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Cable Assemblies
Standard Cable Assemblies
Customised Cable Assemblies
High-Speed Data Networking
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High-Speed Data Networking
CFP2 Connectors
CFP4 Connectors
CFP8 Connectors
OSFP Connectors
QSFP Connectors
QSFP-DD Connectors
SFP Connectors
DSFP / NGSFP Connectors
Internal Connectors
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Internal Connectors
Special Board-To-Board Connectors
Y-Lock Connector Series
ZIF Connector Series
High Speed Board-to-Cable Series
Card Connectors
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Card Connectors
SIM Card Connectors
MICRO-SIM Card Connectors
SD Card Connectors
MICRO-SD Card Connectors
Cables
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Cables
FFC – Flexible Flat Cables
High-Speed FPC Y-Flex
Customised Solutions
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Customised Solutions
Hot-Melt Technology Y-HMT
Flexible Board-to-Board Jumper
Test Solutions
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Test Solutions
Interface Solutions
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Interface Solutions
Y-ETI Series
Automotive Test Adapter
CoM Testadapter
FPC/FFC Testsockel
Contacting Semiconductors
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Contacting Semiconductors
Ball and Pad Devices (BGA CSP LGA)
Quad Flat Non-Leaded (QFN)
Quad Flat Packages Gullwing Leads (QFP)
Small Outline Packages Gullwing Leads (SOP)
J-Leads (SOJ PLCC)
Non-Leaded Devices (LCC)
Single Inline Package (SIP)
Dual Inline Package (DIP)
Burn-In Lead Frame Sockets
PCB Full Custom Solutions
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PCB Full Custom Solutions
PCB Full Custom Service
Specialities – Customized Designs
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Specialities – Customized Designs
Dockings & Accessory
High Rel
Imaging Sensor Sockets
Receptacles
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Test Solutions
Contacting Semiconductors
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Interface Solutions
Contacting Semiconductors
Ball and Pad Devices (BGA CSP LGA)
Quad Flat Non-Leaded (QFN)
Quad Flat Packages Gullwing Leads (QFP)
Small Outline Packages Gullwing Leads (SOP)
J-Leads (SOJ PLCC)
Non-Leaded Devices (LCC)
Single Inline Package (SIP)
Dual Inline Package (DIP)
Burn-In Lead Frame Sockets
PCB Full Custom Solutions
Specialities – Customized Designs
Y-RED Standard & Low Inductance Socket
For pitches starting at 0.30 mm
Suitable for packages CSP/BGA, LGA and QFN
Usage for standard lab & reliability applications
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YED254 Test Contactor
Customised Test Contactor for pitch sizes ≥ 0.30 mm
Easy to close cover
Higher temperature range available
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YED274 Test Contactor
Customised Test Contactor with pitch sizes ≥ 0.25 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g
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IC280-Series - Clamshell
Clamshell THT socket solution for different BGA and LGA packages from 0.65mm up to 1.00mm pitch
Available in 3 pitch sizes and various depopulation versions
V-shape contact structure prevents any damage of coplanarity of the ball contacts
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IC398-Series - Open Top
Open top CMT solution
Suitable for BGA and LGA packages with 0.50 mm pitch
U-shape or double bow contact structure
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IC409-Series - Clamshell
Clamshell CMT solution
Suitable for BGA and LGA packages with 0.50 mm pitch
U-shape or double bow contact structure
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IC511-Series - Clamshell
Clamshell CMT solution
Suitable for BGA and LGA packages with 0.40 mm pitch
U-shape or double bow contact structure
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IC561-Series - Universal Socket
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher
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IC564-Series - Universal Socket
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
IC package dimensions from 2 x 2 to 10 x 10 sqmm
Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular
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NP276-Series - Open Top
Open top THT sockets for BGA packages with 1.27 mm pitch
Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity
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NP291-Series - Open Top
Open top THT socket solution suitable for BGA packages with 0.80 mm pitch
Self-contacting structure without upper pressing force (ZIF)
Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls
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NP351-Series - Open Top
Open top THT socket solution suitable for BGA packages 0.80 mm pitch
Self-contacting structure without upper pressing force (ZIF)
Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls
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NP352-Series - Open Top
Open top type THT sockets for a huge variety of BGA packages 1.00 mm pitch
Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls
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NP383-Series - Open Top
Open top THT socket solution suitable for BGA packages with 0.50 mm pitch
2-point Tweezer Style contact system to nip the sides of solder balls to prevent damages of co-planarity of solder balls
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NP437-Series - Open Top
Open top CMT solution suitable for BGA and LGA packages with 0.40 mm pitch
U-shape or double bow contact structure
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NP481-Series - Open Top
Open top CMT solution suitable for BGA and LGA packages 0.40 mm pitch
U-shape or double bow contact structure
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NP483-Series - Open Top
Open top THT sockets for BGA packages with 1.00 mm pitch
Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
Tweezer contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls
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NP486-Series - Open Top
Open top THT sockets for BGA packages with 1.00 mm pitch
Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
Tweezer contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls
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NP504-Series - Open Top
Open top THT solution for BGA packages with different pitch
Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
Double Buckle Beam contact
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NP584-Series - Universal Socket
Semi-custom open top CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher
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Y-RED Standard & Low Inductance Socket
For pitches starting at 0.30 mm
Suitable for packages CSP/BGA, LGA and QFN
Usage for standard lab & reliablity applications
View product
YED254 Test Contactor
Customised Test Contactor for pitch sizes ≥ 0.30 mm
Easy to close cover
Higher temperature range available
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YED274 Test Contactor
Customised Test Contactor with Pitch sizes ≥ 0.25 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g
View product
IC561-Series - Universal Socket
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher
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IC564-Series - Universal Socket
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
IC package dimensions from 2 x 2 to 10 x 10 sqmm
Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular
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IC609-Series - Clamshell
Clamshell THT socket solution for QFN packages with 0.40 mm pitch
Centre contact available for exposed pads
Suitable for 0.5 - 1.2 mm thick packages
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IC610-Series - Clamshell
Clamshell THT socket solution for QFN packages with 0.50 mm pitch
Centre contact available for exposed pads
Suitable for 0.5 - 1.2 mm thick packages
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NP404-Series - Open Top
Open top THT socket solution for QFN packages with 0.50 mm pitch
Centre signal contacts (electrical) available for exposed pads
Suitable for 0.5 - 1.2mm thick packages
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NP445-Series - Open Top
Open top THT socket solution for QFN packages with 0.50 mm pitch
Centre signal contacts (electrical) available for exposed pads
Suitable for packages up to 1.00 mm thick
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NP506-Series - Open Top
Open top THT socket solution for QFN packages with 0.40 mm and 0.50 mm pitch
Suitable for package outline size in the range 4 - 8 sqmm and 0.70 - 1.30mm thickness
Active alignment for IC package positioning
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NP584-Series - Universal Socket
Semi-custom open top CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher
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QFN11T-Series - Clamshell
Clamshell THT socket solution for QFN packages with 0.40 mm to 0.80 mm pitch
Suitable for package outline size in the range up to 10 x 10 sqmm and 0.50 - 1.30 mm thickness
Cantilever stamped contact type structure
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IC51-Series - Clamshell
Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type
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YED274 Test Contactor
Customised Test Contactor with pitch sizes ≥ 0.30 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g
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IC200-Series - Open Top
Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.40 mm up to 0.80 mm standard
Variable socket outline according to package dimensions
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IC201-Series - Open Top
Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.40 mm up to 0.65 mm standard
Variable socket outline according to package dimensions
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IC217-Series - Open Top
Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch 0.50 mm standard
Variable socket outline according to package dimensions
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IC218-Series - Open Top
Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.65 mm up to 0.80 mm standard
Variable socket outline according to package dimensions
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IC234-Series - Open Top
Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.40 mm up to 0.80 mm standard
Variable socket outline according to package dimensions
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IC248-Series - Open Top
Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.50 mm up to 0.80 mm standard
Variable socket outline according to package dimensions
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IC357-Series - Open Top
Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.40 mm up to 0.80 mm standard
Variable socket outline according to package dimensions
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IC500-Series - Open Top
Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.50 mm up to 0.65 mm standard
Variable socket outline according to package dimensions
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QFP11T-Series - Clamshell
Clamshell THT socket solution suitable for QFP packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type
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YED254 Test Contactor
Customised Test Contactor fo pitch sizes ≥ 0.30 mm
Easy to close cover
Higher temperature range available
View product
YED274 Test Contactor
Customised Test Contactor with pitch sizes ≥ 0.30 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g
View product
IC189-Series - Open Top
Open top THT socket solution suitable for SOP packages with gullwing leads
Pitch from 0.40 mm up to 1.27 mm standard
Variable socket outline according to package dimensions
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IC191-Series - Open Top
Open top THT socket solution suitable for SOP packages with gullwing leads
Pitch 0.50 mm standard
Variable socket outline according to package dimensions
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IC235-Series - Open Top
Open top THT socket solution suitable for SOP packages with gullwing leads
Pitch from 0.80 mm up to 1.27 mm standard
Variable socket outline according to package dimensions
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IC51-Series - Clamshell
Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type
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IC100-Series - Open Top
Open top THT socket solution suitable for SOJ packages to be inserted in "dead-bug" orientation
Pitch 1.27 mm standard
Variable socket outline according to package dimensions
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IC107-Series - Open Top
Open top THT socket solution suitable for SOJ packages to be inserted in "live-bug" orientation
Pitch 1.27 mm standard
Variable socket outline according to package dimensions
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IC120-Series - Open Top
Open top THT socket solution suitable for SOJ packages to be inserted either in "live-bug" or "dead-bug" orientation
Pitch 1.27 mm standard
Variable socket outline according to package dimensions
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IC51-Series - Clamshell
Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type
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IC51-Series - Clamshell
Clamshell THT socket solution suitable for QFP, SOP, LCC and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type
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IC53-Series - Clamshell
Clamshell THT socket solution suitable for LCC packages
Pitch 1.27 mm standard
Cantilever stamped contact type
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IC70-Series - Open Top
Open top THT socket solution suitable for Single Inline packages (SIP)
Pitch from 1.00mm up to 2.00mm standard
Variable socket outline according to package dimensions
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IC121-Series - Open Top
Open top THT socket solution suitable for Dual Inline packages (DIP)
Pitch 1.778 mm pitch standard
Variable socket outline according to package dimensions
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IC37-Series - Open Top
Open top THT socket solution suitable for Dual Inline packages (DIP)
Pitch 2.54 mm pitch standard
Variable socket outline according to package dimensions
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YED900 High Volume Burn-In Socket
Contacting lead frames
High pin count capable
Reliable probe pin technology
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