Contacting Semiconductors Product Overview | Yamaichi Electronics

Y-RED Standard & Low Inductance Socket

Y-RED Standard & Low Inductance Socket

For pitches starting at 0.30 mm
Suitable for packages CSP/BGA, LGA and QFN
Usage for standard lab & reliability applications

YED254 Test Contactor

YED254 Test Contactor

Customised Test Contactor for pitch sizes ≥ 0.30 mm
Easy to close cover
Higher temperature range available

YED274 Test Contactor

YED274 Test Contactor

Customised Test Contactor with pitch sizes ≥ 0.25 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g

IC280-Series - Clamshell

IC280-Series - Clamshell

Clamshell THT socket solution for different BGA and LGA packages from 0.65mm up to 1.00mm pitch
Available in 3 pitch sizes and various depopulation versions
V-shape contact structure prevents any damage of coplanarity of the ball contacts

IC398-Series - Open Top

IC398-Series - Open Top

Open top CMT solution
Suitable for BGA and LGA packages with 0.50 mm pitch
U-shape or double bow contact structure

IC409-Series - Clamshell

IC409-Series - Clamshell

Clamshell CMT solution
Suitable for BGA and LGA packages with 0.50 mm pitch
U-shape or double bow contact structure

IC511-Series - Clamshell

IC511-Series - Clamshell

Clamshell CMT solution
Suitable for BGA and LGA packages with 0.40 mm pitch
U-shape or double bow contact structure

IC561-Series - Universal Socket

IC561-Series - Universal Socket

Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher

IC564-Series - Universal Socket

IC564-Series - Universal Socket

Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
IC package dimensions from 2 x 2 to 10 x 10 sqmm
Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular

NP276-Series - Open Top

NP276-Series - Open Top

Open top THT sockets for BGA packages with 1.27 mm pitch
Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity

NP291-Series - Open Top

NP291-Series - Open Top

Open top THT socket solution suitable for BGA packages with 0.80 mm pitch
Self-contacting structure without upper pressing force (ZIF)
Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls

NP351-Series - Open Top

NP351-Series - Open Top

Open top THT socket solution suitable for BGA packages 0.80 mm pitch
Self-contacting structure without upper pressing force (ZIF)
Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls

NP352-Series - Open Top

NP352-Series - Open Top

Open top type THT sockets for a huge variety of BGA packages 1.00 mm pitch
Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls

NP383-Series - Open Top

NP383-Series - Open Top

Open top THT socket solution suitable for BGA packages with 0.50 mm pitch
2-point Tweezer Style contact system to nip the sides of solder balls to prevent damages of co-planarity of solder balls

NP437-Series - Open Top

NP437-Series - Open Top

Open top CMT solution suitable for BGA and LGA packages with 0.40 mm pitch
U-shape or double bow contact structure

NP481-Series - Open Top

NP481-Series - Open Top

Open top CMT solution suitable for BGA and LGA packages 0.40 mm pitch
U-shape or double bow contact structure

NP483-Series - Open Top

NP483-Series - Open Top

Open top THT sockets for BGA packages with 1.00 mm pitch
Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
Tweezer contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls

NP486-Series - Open Top

NP486-Series - Open Top

Open top THT sockets for BGA packages with 1.00 mm pitch
Secure package alignment due to self-contacting structure without upper pressing force(ZIF)
Tweezer contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls

NP504-Series - Open Top

NP504-Series - Open Top

Open top THT solution for BGA packages with different pitch
Secure package alignment due to self-contacting structure without upper pressing force (ZIF)
Double Buckle Beam contact

NP584-Series - Universal Socket

NP584-Series - Universal Socket

Semi-custom open top CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher

Y-RED Standard & Low Inductance Socket

Y-RED Standard & Low Inductance Socket

For pitches starting at 0.30 mm
Suitable for packages CSP/BGA, LGA and QFN
Usage for standard lab & reliablity applications

YED254 Test Contactor

YED254 Test Contactor

Customised Test Contactor for pitch sizes ≥ 0.30 mm
Easy to close cover
Higher temperature range available

YED274 Test Contactor

YED274 Test Contactor

Customised Test Contactor with Pitch sizes ≥ 0.25 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g

IC561-Series - Universal Socket

IC561-Series - Universal Socket

Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher

IC564-Series - Universal Socket

IC564-Series - Universal Socket

Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
IC package dimensions from 2 x 2 to 10 x 10 sqmm
Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular

IC609-Series - Clamshell

IC609-Series - Clamshell

Clamshell THT socket solution for QFN packages with 0.40 mm pitch
Centre contact available for exposed pads
Suitable for 0.5 - 1.2 mm thick packages

IC610-Series - Clamshell

IC610-Series - Clamshell

Clamshell THT socket solution for QFN packages with 0.50 mm pitch
Centre contact available for exposed pads
Suitable for 0.5 - 1.2 mm thick packages

NP404-Series - Open Top

NP404-Series - Open Top

Open top THT socket solution for QFN packages with 0.50 mm pitch
Centre signal contacts (electrical) available for exposed pads
Suitable for 0.5 - 1.2mm thick packages

NP445-Series - Open Top

NP445-Series - Open Top

Open top THT socket solution for QFN packages with 0.50 mm pitch
Centre signal contacts (electrical) available for exposed pads
Suitable for packages up to 1.00 mm thick

NP506-Series - Open Top

NP506-Series - Open Top

Open top THT socket solution for QFN packages with 0.40 mm and 0.50 mm pitch
Suitable for package outline size in the range 4 - 8 sqmm and 0.70 - 1.30mm thickness
Active alignment for IC package positioning

NP584-Series - Universal Socket

NP584-Series - Universal Socket

Semi-custom open top CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
Pitch from 0.30mm standard, staggered or irregular
Full flexibility through drilled insulator and milled pusher

QFN11T-Series - Clamshell

QFN11T-Series - Clamshell

Clamshell THT socket solution for QFN packages with 0.40 mm to 0.80 mm pitch
Suitable for package outline size in the range up to 10 x 10 sqmm and 0.50 - 1.30 mm thickness
Cantilever stamped contact type structure

IC51-Series - Clamshell

IC51-Series - Clamshell

Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type

YED274 Test Contactor

YED274 Test Contactor

Customised Test Contactor with pitch sizes ≥ 0.30 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g

IC200-Series - Open Top

IC200-Series - Open Top

Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.40 mm up to 0.80 mm standard
Variable socket outline according to package dimensions

IC201-Series - Open Top

IC201-Series - Open Top

Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.40 mm up to 0.65 mm standard
Variable socket outline according to package dimensions

IC217-Series - Open Top

IC217-Series - Open Top

Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch 0.50 mm standard
Variable socket outline according to package dimensions

IC218-Series - Open Top

IC218-Series - Open Top

Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.65 mm up to 0.80 mm standard
Variable socket outline according to package dimensions

IC234-Series - Open Top

IC234-Series - Open Top

Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.40 mm up to 0.80 mm standard
Variable socket outline according to package dimensions

IC248-Series - Open Top

IC248-Series - Open Top

Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.50 mm up to 0.80 mm standard
Variable socket outline according to package dimensions

IC357-Series - Open Top

IC357-Series - Open Top

Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.40 mm up to 0.80 mm standard
Variable socket outline according to package dimensions

IC500-Series - Open Top

IC500-Series - Open Top

Open top THT socket solution suitable for QFP packages with gullwing leads
Pitch from 0.50 mm up to 0.65 mm standard
Variable socket outline according to package dimensions

QFP11T-Series - Clamshell

QFP11T-Series - Clamshell

Clamshell THT socket solution suitable for QFP packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type

YED254 Test Contactor

YED254 Test Contactor

Customised Test Contactor fo pitch sizes ≥ 0.30 mm
Easy to close cover
Higher temperature range available

YED274 Test Contactor

YED274 Test Contactor

Customised Test Contactor with pitch sizes ≥ 0.30 mm
Manual or automated applications
Contact force (typical) between 15 g to 35 g

IC189-Series - Open Top

IC189-Series - Open Top

Open top THT socket solution suitable for SOP packages with gullwing leads
Pitch from 0.40 mm up to 1.27 mm standard
Variable socket outline according to package dimensions

IC191-Series - Open Top

IC191-Series - Open Top

Open top THT socket solution suitable for SOP packages with gullwing leads
Pitch 0.50 mm standard
Variable socket outline according to package dimensions

IC235-Series - Open Top

IC235-Series - Open Top

Open top THT socket solution suitable for SOP packages with gullwing leads
Pitch from 0.80 mm up to 1.27 mm standard
Variable socket outline according to package dimensions

IC51-Series - Clamshell

IC51-Series - Clamshell

Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type

IC100-Series - Open Top

IC100-Series - Open Top

Open top THT socket solution suitable for SOJ packages to be inserted in "dead-bug" orientation
Pitch 1.27 mm standard
Variable socket outline according to package dimensions

IC107-Series - Open Top

IC107-Series - Open Top

Open top THT socket solution suitable for SOJ packages to be inserted in "live-bug" orientation
Pitch 1.27 mm standard
Variable socket outline according to package dimensions

IC120-Series - Open Top

IC120-Series - Open Top

Open top THT socket solution suitable for SOJ packages to be inserted either in "live-bug" or "dead-bug" orientation
Pitch 1.27 mm standard
Variable socket outline according to package dimensions

IC51-Series - Clamshell

IC51-Series - Clamshell

Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type

IC51-Series - Clamshell

IC51-Series - Clamshell

Clamshell THT socket solution suitable for QFP, SOP, LCC and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type

IC53-Series - Clamshell

IC53-Series - Clamshell

Clamshell THT socket solution suitable for LCC packages
Pitch 1.27 mm standard
Cantilever stamped contact type

IC70-Series - Open Top

IC70-Series - Open Top

Open top THT socket solution suitable for Single Inline packages (SIP)
Pitch from 1.00mm up to 2.00mm standard
Variable socket outline according to package dimensions

IC121-Series - Open Top

IC121-Series - Open Top

Open top THT socket solution suitable for Dual Inline packages (DIP)
Pitch 1.778 mm pitch standard
Variable socket outline according to package dimensions

IC37-Series - Open Top

IC37-Series - Open Top

Open top THT socket solution suitable for Dual Inline packages (DIP)
Pitch 2.54 mm pitch standard
Variable socket outline according to package dimensions

YED900 High Volume Burn-In Socket

YED900 High Volume Burn-In Socket

Contacting lead frames
High pin count capable
Reliable probe pin technology